JGBM-2000+ Full Auto Module Bonding Machine

Equipment Process Use

This machine is for the connecting of antenna with the module in the production of contactless (RFID) cards.


●The system can follow and adjust the ultrasonic energy parameter automatically during regular running process.
●Layouts can be saved by CPU and each one can be used directly.
●Servo positioning system can control the bonding location exactly.
●Advanced ultrasonic technology is applied to bond by instant large current. .
●Dowel positioning in the material installation
●Easy operation by color touch screen to support problems solved solution.
●Multi-head bonding is available to improve the running speed.

Technical Parameters

    Dimension: H2000*W1080*L1400mm
    Weight: about 1500kg
    Electric: AC220V 50/60HZ 60A
    Power: 50KW
    Compress Air: 6 kg/cm2
    Air Consumption: 50L/min
    Control Method: Servo located + PLC control
    Servo Precision: X, Y=0.0125mm
    Tolerance: 0.01mm
    Operator: 1 person
    Output: 2500-3000pcs/h

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2/F,3 Building,LeBao Industrial Zone,FengXin Road,GuangMing New District,Shenzhen,China 518107

+86 0755 27961335/+86 0755 27962729

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