JGMI Semi-automatic packaging machines

Equipment Process Use

Features
●The hot melt heated pasted onto the chip, and the chip punching down。
●Temperature, time, pressure can be adjusted。
●Finished collected automatically, simple operation, easy to adjust。


Features

Features
●The hot melt heated pasted onto the chip, and the chip punching down。
●Temperature, time, pressure can be adjusted。
●Finished collected automatically, simple operation, easy to adjust。

Technical Parameters

    Technical parameters
    Dimensions: H25 * W45 * LlOOmm
    Weight: about 25kg
    Power supply:AC220V 50/60HZ 5A
    Compressed air:6kg/cm2
    Operator: 1 person

Online message

2/F,3 Building,LeBao Industrial Zone,FengXin Road,GuangMing New District,Shenzhen,China 518107

+86 0755 27961335/+86 0755 27962729

yq.liu@jinguantech.com
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